Materials and Processes

Dielectric barriers
Dielectric cappings
Diffusion barriers
Etch-stop liners
Germanides
High-k dielectrics
Insulators for phase change memories
Packaging materials and technologies
Porous ULK and ELK dielectrics
Resistive oxides
Self aligned barriers
Silicides
Deposition, patterning, cleaning, surface functionnalization & other process aspects
PVD, CVD, ECD, ALD, CMP & innovative processes

Architecture and device integration

Air gap insulation
Contacts
Dual Damascene architecture
Metal gates
Multilevel copper interconnects
Through silicon vias

Advanced components

3D integration
Copper and non copper advanced interconnects
Carbon nanotubes
Memories devices : MRAM, FeRAM, CBRAM, PCRAM, …
MEMS, NEMS
Nanodots, nanowires
Optical interconnects
Passive components
Wireless systems

Reliability and performance

Design for manufacturing, for reliability and for yield
Electrical characterizations
Electromigration and stressmigration
Mechanical and thermal integrity
Modeling and simulation
Propagation performance
Reliability and lifetime analysis
System-on-chip and system-in-package
Thin films characterization
X-architecture for design