Thank you very much for contributing to MAM 2010 conference!

In 2011, MAM will be held in conjunction with the International Interconnect Technology Conference (IITC) in Dresden (Germany), 8-12 May 2011.

Further information will be available shortly at the IITC website.

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WELCOME AT THE 2010 MATERIALS FOR ADVANCED METALLIZATION CONFERENCE HOME PAGE

This workshop is the 19th in a series devoted to materials research, materials properties and interactions.

Starting with refractory metals and silicides in the 80's, moving to materials for advanced metallization in 1995, this year's workshop addresses new and challenging topics in the field of BEOL solutions, novelties in alternative interconnect systems and more widely advanced materials and structures relevant to micro and nano-electronics.

The objective of the workshop is to provide a forum for open discussions between science and industrial application. It is dedicated to material scientists, process and integration engineers and Ph-D students.

Topics include both fundamental and applied research, as well as issues related to introduction into manufacturing. With the progressive downscaling of device dimensions and the simultaneous demand for more functionality, the challenges have become tremendous. New and extensive materials research is needed to further follow IC scaling as well as to develop new devices at the nanoscale.

Invited talks will be given by scientific and technical leaders in each of the key areas to present the current state-of-the-art and to stimulate technical discussions.

1. ■Metal process
   

2. ■Silicides
   

3. ■Dielectrics
   

4. ■3D integration, passive devices, packaging
   

5. ■Contact / metal gate
   

6. ■Cu interconnect integration
   

7. ■Materials properties at nanoscale
   

8. ■Nanostructures
   

9. ■Materials for memories
   

10. ■Simulation & modeling