TOPICS of MAM2009
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Materials and processes
- Dielectric barriers,
- Dielectric cappings,
- Diffusion barriers,
- Etch-stop liners,
- Germanides,
- High-k dielectrics,
- Insulators for phase change memories,
- Packaging materials and technologies,
- Porous ULK and ELK dielectrics,
- Resistive oxides,
- Self aligned barriers,
- Silicides,
- Deposition, patterning, cleaning, surface functionnalization & other process aspects,
- PVD, CVD, ECD, ALD, CMP & innovative processes
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Architecture and device integration
- Air gap insulation,
- Contacts,
- Dual Damascene architecture,
- Metal gates,
- Multilevel copper interconnects,
- Through silicon vias
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Advanced components
- 3D integration,
- Copper and non copper advanced interconnects,
- Carbon nanotubes,
- Memories devices : MRAM, FeRAM, CBRAM, PCRAM, …
- MEMS, NEMS,
- Nanodots, nanowires,
- Optical interconnects
- Passive components,
- Wireless systems
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Reliability and performance
- Design for manufacturing, for reliability and for yield,
- Electrical characterizations,
- Electromigration and stressmigration,
- Mechanical and thermal integrity,
- Modeling and simulation,
- Propagation performance,
- Reliability and lifetime analysis,
- System-on-chip and system-in-package,
- Thin films characterization,
- X-architecture for design
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