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| TOPICS OF MATERIALS FOR ADVANCED MICRO- AND NANOELECTRONICS |
| Materials and Structures for Advanced Micro- and Nanoelectronics |
| = Strained Silicon /SiGe |
| = Nanowires / Carbon nanotubes (CNT) |
| = Metallic nano-dots |
| = Metallization aspects of molecular electronics: metal-molecule interfacing, |
| electron injection into molecular wires |
| Basics and fundamental studies |
= Kinetics and thermodynamics of reactions |
= Precursor chemistry and delivery |
| Metallization |
| = Metal gates, electrodes for high k dielectrics and capacitors |
= Copper interconnects: deposition, properties, integration |
= Advanced Al and non-Cu metallization |
| = Diffusion barriers: advanced materials and deposition methods, |
material interaction, barrier performance |
| = Electrochemical/electroless processes: seedless deposition, |
seed layer repair approaches, grain size and morphology engineering |
= New metallization materials for MRAM, FeRAM |
= Interconnects for surface acoustic wave (SAW) devices |
= High temperature metallization (sensors) |
= MEMS / NEMS related metallization issues |
| Low k and ULK dielectrics (dense and porous) |
| = Deposition process & equipment |
| = Properties & characterization |
| = Patterning: etch, strip, hardmasks |
| = Integration challenges: interactions with materials and processes, adhesion... |
| = Air gap structures |
| = Porosity related issues: pore sealing, cap layers, mechanical strength |
| Silicides |
| = Advanced silicides and salicides for gate & source / drain |
| = Growth, properties, integration |
| = Silicides for alternative applications |
| Nanoscale Interconnects |
| = Size effects, morphology studies |
| = Research on understanding and improving resistance increase of narrow Cu lines |
| = Shrinking of conventional interconnects |
| Multilevel Metallization |
| = Damascene / Dual Damascene |
| = RIE and other subtractive approaches |
| = CMP of metals and dielectrics: New CMP materials and processes, |
| CMP related and defectivity issues, Electrochemical polishing, Advanced end point detection |
| = Integration issues of Cu/low-k in MLM systems |
| = Optical interconnects |
| = RF / wireless interconnects |
| = X-architecture design |
| Integrated Passives |
| = Capacitors: electrodes, insulator |
| = Inductors / coils |
| = Precision metal resistors, new materials and integration |
| = Integration and assessment |
| = On-chip integrated, in package integrated... |
| Reliability, Lifetime and Analytical Techniques Related to Interconnects and Dielectrics |
| = Electromigration |
| = Stressmigration |
| = Void formation mechanisms and detection |
| = Acoustomigration in SAW device metallization |
| = Dielectrics: Breakdown, leakage, BTS, charges, drift of k-value |
| = New failure types and failure distribution evaluation |
| = Extrapolation models and lifetime prediction for new materials and integration schemes |
| = Interconnect / packaging interaction related reliability |
| = Advanced analytical techniques for material and interconnect characterization |
| Interconnect related packaging issues |
| = FlipChip, 3D interconnects, wafer on wafer and chip on chip approaches |
| = Redistribution layers and materials |
| = System on chip, system in package |
| = Low-k related packaging issues |