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KEYNOTE |
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| O. Joubert LTM, France |
"Challenges and future prospects in plasma etching processes" | |
INVITED TALKS |
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| 3D Integration, Passive devices & Packaging | ||
| L. Di cioccio CEA-LETI Minatec, France |
"Physics of direct bonding : applications to heterogeneous or monolithic integration" | |
| X. Gagnard STMicroelectronics,France |
"Through Silicon Via: from the CMOS Imager Sensor Wafer Level Packaged to the 3D integration scheme" | |
Nanostructures |
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| K. Banerjee Univ. of California-Santa Barbara, US |
"Carbon Nanomaterials for Next-Generation Interconnects and Passives: Physics, Status and Prospects" | |
| M. Nihei MIRAI-Selete /Fujitsu Laboratories Ltd., Japan |
"Integration of carbon nanotubes for LSI via interconnects" | |
Memory devices |
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| S. Lombardo IMM, Italy |
"Amorphous - polycrystalline fcc transition in Ge2Sb2Te5 thin films" | |
| M. Alessandri NUMONIX, Italy |
"Rare-earth based high-k materials for NVM applications" | |
Silicides |
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| C. Detavernier University of Gent, Belgium |
"Hexagonal theta nickel silicide : an unexpected phase in the Ni-Si syste" | |
| A. C. Diebold CNSE, NanoTech, Albany, US |
"Advanced Optical Measurements for Advanced Transistor Processes" | |
Cu Interconnect Integration |
K. Schulze TU Chemnizt, Germany |
"Airgap Integration: Fabrication by Sacrificial Etch, Thermal and Mechanical Behavior, Reliability" |
Metal Process |
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| D. Galpin STMicroelectronics, Crolles, France |
"Scalability of Trench First Metal Hard Mask Dual Damascene Architecture" | |
Reliability |
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| Zs. Tokei IMEC, Belgium |
"Reliability of copper low-k interconnects" | |
Advanced characterization and materials properties at the nanoscale |
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| GIANOLA D. S. Forschungszentrum Karlsruhe, Germany |
"Mechanical Testing of Quasi-1D Metal Nanostructures" | |
Dielectrics |
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| JJ. Vlassack Harvard University, US |
"Ultra Low Permittivity Organosilicate Glass Coatings : Mechanical Properties and Fracture behavior" | |