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MAM2009 CONFERENCE PROGRAMME |
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Detailed previsionnal programme to download. See also Invited Talks. There will be one poster session on TUESDAY afternoon. |
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Sunday March 8 |
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| 6.00 pm 7.00 pm |
Conference Registration |
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Monday March 9 |
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8.30 - 9.15 am |
OPENING SESSION |
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| 8.30 am 8.40 am |
Keynote |
CHENEVIER B. JOUBERT O. |
Welcome Challenges and future prospects in plasma etching processes" |
9.15 - 12.25 am |
SESSION Silicides - Chair O. THOMAS |
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| 9.15 am 11.35 am |
invited " |
DETAVERNIER C. DIEBOLD A. C. |
Hexagonal theta nickel silicide : an unexpected phase in the Ni-Si system. Advanced Optical Measurements for Advanced Transistor Processes |
| Lunch (12.30 - 14.00 am) | |||
2.00 - 4.00 pm |
SESSION Memory devices - Chair : F. VOLPI |
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| 2.00 pm 3.30 pm |
invited " |
ALESSANDRI M. LOMBARDO S. |
Rare-earth based high-k materials for NVM applications Amorphous - polycrystalline fcc transition in Ge2Sb2Te5 thin films |
4.30 - 6.20 pm |
SESSION Cu interconnect integration - Chair : R. MADAR |
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| 4.30 p m | invited | SCHULZE K. | Airgap Integration: Fabrication by Sacrificial Etch, Thermal and Mechanical Behavior, Reliability |
7.30 pm |
EVENING reception at the Grenoble City Hall |
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Tuesday March 10 |
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8.30 - 10.20 am |
SESSION Reliability - Chair : Y. SHACHAM-DIAMAND |
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| 8.30 am | invited | TOKEI Zs. | Reliability of copper low-k interconnects |
10.50 - 12.00 am |
SESSION Metal process - Chair : S. MAITREJEAN |
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| 10.50 am | invited | GALPIN D. | Scalability of Trench First Metal Hard Mask Dual Damascene Architecture |
| Lunch 12.00 - 13.30 am | |||
1.30 - 3.00 pm |
Advanced characterization and materials properties at the nanoscale - Chair : Y. TRAVALY |
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| 1.30 p m | invited | GIANOLA D. S. | Mechanical Testing of Quasi-1D Metal Nanostructures |
3.00 - 4.10 pm |
SESSION Nanostructures - Chair : B. CHENEVIER |
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| 3.00 p m | invited | BANERJEE K. | Carbon Nanomaterials for Next-Generation Interconnects and Passives: Physics, Status and Prospects |
4.10 - 6.30 pm |
SESSION POSTERS |
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7.00pm |
Conference Diner "Chez le Père Gras" |
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Wednesday March 11 |
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8.30 - 9.20 am |
SESSION Nanostructures (continued) |
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| 8.30 am | invited | NIHEI M. | Integration of carbon nanotubes for LSI via interconnects |
9.20 - 10.50 am |
SESSION Dielectrics - Chair : A. FARCY |
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| 9.20 am | invited | Vlassak J. J. | Ultra Low Permittivity Organosilicate Glass Coatings : Mechanical Properties and Fracture behavior |
11.20 - 13.20 am |
SESSION 3D integration & packaging - Chair : S.E. SCHULZ |
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| 11.20 am 12.30 am |
invited " |
GAGNARD X. Di CIOCCIO L. |
Through Silicon Via : from the CMOS Imager Sensor Wafer Level Packaged to the 3D integration scheme. Physics of direct bonding : applications to heterogeneous or monolithic integration. |
13.20 - 13.30 am |
Closing Remarks - CHENEVIER B. |
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| Lunch (13.30 - 15.00) | |||