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TOPICS of MAM2009

  • Materials and processes

    • Dielectric barriers,
    • Dielectric cappings,
    • Diffusion barriers,
    • Etch-stop liners,
    • Germanides,
    • High-k dielectrics,
    • Insulators for phase change memories,
    • Packaging materials and technologies,
    • Porous ULK and ELK dielectrics,
    • Resistive oxides,
    • Self aligned barriers,
    • Silicides,
    • Deposition, patterning, cleaning, surface functionnalization & other process aspects,
    • PVD, CVD, ECD, ALD, CMP & innovative processes
  • Architecture and device integration

    • Air gap insulation,
    • Contacts,
    • Dual Damascene architecture,
    • Metal gates,
    • Multilevel copper interconnects,
    • Through silicon vias
  • Advanced components

    • 3D integration,
    • Copper and non copper advanced interconnects,
    • Carbon nanotubes,
    • Memories devices : MRAM, FeRAM, CBRAM, PCRAM, …
    • MEMS, NEMS,
    • Nanodots, nanowires,
    • Optical interconnects
    • Passive components,
    • Wireless systems
  • Reliability and performance

    • Design for manufacturing, for reliability and for yield,
    • Electrical characterizations,
    • Electromigration and stressmigration,
    • Mechanical and thermal integrity,
    • Modeling and simulation,
    • Propagation performance,
    • Reliability and lifetime analysis,
    • System-on-chip and system-in-package,
    • Thin films characterization,
    • X-architecture for design